Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23-7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
- Manufactured in Japan!
- Designed by Shin-Etsu
- Optimal Efficiency and Thermal Transfer
- Convenient Syringe Design for Easy Application
|Viscosity (Pascal * Second):||200|
|Bleed (423°K/24 hr):||0|
|Thermal Conductivity:||6.0 (W/mK)|
|Storage:||Room Temperature (1 year)|
Shin-Etsu X23-7783D Silicone Thermal Compound - 1g
- Brand: Arctic Silver
- Product Code: X23-7783D
- Availability: In Stock