Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23-7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.


  • Manufactured in Japan!
  • Designed by Shin-Etsu
  • Optimal Efficiency and Thermal Transfer
  • Convenient Syringe Design for Easy Application
Color: Gray
Viscosity (Pascal * Second): 200
Appearance: Grey
Bleed (423°K/24 hr): 0
Thermal Conductivity: 6.0 (W/mK)
Specific Gravity: 2.55
Volatile Content: 2.43%
Storage: Room Temperature (1 year)

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Shin-Etsu X23-7783D Silicone Thermal Compound - 1g

  • Brand: Arctic Silver
  • Product Code: X23-7783D
  • Availability: In Stock
  • $7.99

Tags: Shin-Etsu